The company has grown since then to more than employees today. Our products help increase production efficiency, optimize processes and. The microDICE™ laser micromachining system leverages TLS-Dicing™.
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This collaboration will strengthen the competitiveness of the semiconductor and system suppliers to design innovative MtM and SiP products in respect to reliability, quality, cost and shorter time to market to ensure leadership in a global perspective.
Display and Smart Glasses. Brittle-rigid materials such as glass, ceramic and sapphire have excellent material properties that make them indispensible for use in the production midromac electronics. Approaches for precise local laser doping based on d3 equipment concepts should be developed as well as a process based on a cost efficient infrared laser source.
We are one of the first companies in the world to focus on the use of ultra-short pulse lasers for the processing of materials. Development of industrial-suited excimer-laser system for marking of ophthalmic lenses Its high throughput, outstanding edge quality and mm wafer capable platform enables a true high-volume production process, especially for SiC-based devices. Cost, quality and throughput are major factors in achieving successful manufacturing in the semiconductor industry.
This should lead to an increased lifetime of the solar modules. Setting Worldwide Standards in Laser Micromachining. Some of the technologies are being researched in cooperation with cooperation partners from the partner cluster in Yonezawa, Japan.
Therefore, we are very proud to be certified to the ISO quality standard since If you continue to use this site we will assume that you are happy with it. At micrmoac same micromsc, traditional scaling of feature sizes in microelectronics is becoming increasingly cost prohibitive in order to add more functionality on devices within a smaller footprint.
Our expertise and engineering competency allow us to stand alongside our customers as reliable partners in technology and process development as well as in the development of OEM-manufacturing solutions and customer-specific systems. The main goal is to separate the cells without inducing damage at the cutting edge. Although lasers are well established tools in manifold applications, they have been broadly ignored for use in sample preparation due to concerns regarding their potential for causing structural damage.
We support our customers across the entire product life cycle, from process development and selection of a suitable machine design to commissioning and comprehensive servicing. Our innovations are built on more than ten years of expertise in laser micromachining. This has created a greater need for methods of processing surface layers of the device without affecting buried structures, as well as selective exposure of functional areas on the device.
3D-Micromac AG – Silicon Saxony e.V.
Wir verwenden Cookies, um Inhalte und Anzeigen zu personalisieren und die Zugriffe auf unsere Website zu analysieren. As a further challenge, laser cutting and structuring processes are developed for substrate separation and interconnection.
The on-the-fly processing guarantees highest productivity and an outstanding price-performance ratio. At the end of the project a throughput of Wafer per hour should be reached. This immensely helps to reduce ramp-up times in production. Winner of the Saxon Innovation Prize For the production in the roll-to-roll process, the winding processes of the thin glass substrate must first be integrated to the coating unit.
Our technologies have set international standards for true innovation.
Extremely precise positioning systems, innovative beam-delivery concepts as well as numerous process monitoring methods offer the highest possible process reliability and a maximum speed of machining. Besides the integration of laser processing, also printing and coating techniques can be integrated.
Today, however, the use of ultrashort pulses and optimized processing routes is addressing these concerns and enabling laser processing to finally enter the scene — speeding up microstructure diagnostics and failure analysis midromac well as opening microac access to deeply buried structures and large-area preparation.
Excellent Support and Service. Opening of the company headquarters at the Chemnitz Technology Campus With that we have established a strong foundation for dynamic growth in international markets. All systems use UV lasers for permanent marking. New company headquarter The separated cells show a significantly higher mechanical strength, better edge quality and a lower power reduction compared to laser scribing and breaking approaches.
The project will also support European analytical equipment providers, many of them SME, to explore new market opportunities, design new equipment, and to align their developments to future needs of new system integration technologies.
What is our motivation? Microdiagnostics and Failure Analysis. Microstructure diagnostics and failure analyses are pivotal for the ongoing improvement of functional materials and sophisticated electronic components.
For this reason, 3D-Micromac continuously works on innovative laser processes and solutions for optimizing manufacturing processes, productivity, and effectiveness of silicon solar cells.
Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the mass production of crystalline solar cells.
3D-Micromac – Our Headquarter in Chemnitz, Germany
The constant cost pressure in the photovoltaic industry as a continues challenge to solar cell manufacturers can only be solved by increasing cell efficiency with simultaneous reducing manufacturing costs. Our aim is to provide superb customer satisfaction even for the most complex projects. We develop processes, machines and turnkey solutions at the highest technical and technological level. As a result, chip manufacturers are turning toward vertical stacking of devices and heterogenous integration schemes to enable smaller, higher-performance devices.
This opens up a huge variety of possibilities and niche applications for BIPV. The system features a line scan option for vertical selective annealing and a step-and-repeat spot option for horizontal selective annealing, as well as three optional wavelength lasers near infrared, green and ultravioletresulting in a highly flexible, high-quality laser annealing 3x.
The micromc aims to develop large-scale lighting applications using organic light-emitting diodes OLEDs on flexible substrates.
In its strategic alignment 3D-Micromac concentrates particularly on international and high-growth, high-tech markets. Furthermore a technology for cutting solar cells is especially interesting for national producers of special solar modules who can use it for the production of special formed modules. The electrical and mechanical properties of the cells after cutting are micrimac the focus of the investigations.
If you continue to use this site we will assume that you are micrimac with it.